Vespel® SP-1 is an unfilled or “neat” polyimide (PI) polymer that offers high flexural and tensile properties, toughness and resilience, resistance to friction and wear, and thermal and electrical insulative properties. It is also recognized for its thermal oxidative stability.

Vespel® SP-1 Properties Profile

Components machined from Vespel® SP-1 perform well at cryogenic conditions and can operate continuously at temperatures of 300 °C / 570 °F. The material can also tolerate brief temperature excursions to 500 °C / 932 °F. As a polyimide polymer, Vespel® SP-1 also has no glass transition temperature (Tg) or softening point. Rather than a gradual drop in performance as operating temperatures rise, it maintains a high level of its property values until it approaches its upper operating temperature limit.

Compared to other commercially available unfilled polyimides, Vespel® SP-1 has a unique combination of higher elongation and impact strength, resulting in machined components that exhibit more toughness and resilience.

Vespel® SP-1 Availability -

Drake offers the full range of Vespel® SP-1 shapes and sizes.

Available from Drake Plastics Inventory:

  • Rod diameters: 3.1 – 82.5 mm /0.125 – 3.125 in.

  • Max Length: 965.2 mm /38 in.

Data Sheet
Pricing & Availability

Vespel® SP-1 Typical Applications

The thermal stability, purity and minimal outgassing of Vespel®  SP-1 in plasma environments make it a viable option for components used in semiconductor manufacturing. Its wear and friction resistance and chemical resistance are key properties behind its use as a material for dynamic load bearing applications. Regulatory agency ratings on flammability and smoke generation have led to specifications for electrical, electronic and aerospace components as well. Other applications that capitalize on Vespel® SP-1’s overall performance benefits include:

  • Vespel® Thermal and electrical insulators
  • Aircraft mechanical and electrical components
  • Valve seats, seals, including in cryogenic and high temperature environments
  • Balls and poppets
  • Semiconductor process components including etch, wafer handling and device test sockets.

Vespel® SP-1 Specifications

DuPontTM Vespel® SP-1 is available as isostatically molded billets and unidirectionally pressed slab specified as Type IM and Type IP respectively according to ASTM D6456-10 / MIL-R-46198. Vespel® SP-1 is specified as Class 1 according to AMS 3644G.

Vespel® is a registered trademark of E.I. DuPont de Nemours and Company

Many Custom Sizes Available

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